We are Aptiv - a global technology company with 190,000 specialists in 46 countries. We develop innovative software and build the hardware to bring autonomous driving cars, advanced driver-assistance systems, connected vehicles and smart cities to life in a way that only we can. We work in partnership with almost all car manufacturers. Our sensors, systems and software can already be found in almost all passenger cars today.

With our deep domain expertise, Aptiv is developing solutions that solve our customers' toughest challenges. We are enabling the transition to software-defined vehicles supported by electrified and intelligently connected architectures – which will combine to power the future of mobility.

Aptiv’s custom silicon management group provides critical custom Silicon for all Aptiv products including Autonomous Driving, ADAS, Infotainment, Zonal Control, and others. This team translates the system requirements of Aptiv’s next-generation products into the SOC/IC requirements and architectural design, then manages the technical performance of external SOC/IC design partners who design the custom silicon SOCs/ICs for use in Aptiv’s products.

Your Role

We are looking for an experienced package design engineer with excellent communication and supplier interfacing skills to complete packaging design projects/targets. This is an individual contributor role with high visibility and ideal person will lead packaging design related discussion with SOC design suppliers regularly. As part of Aptiv Custom Semiconductor management team, you will lead and drive packaging technology development of advanced SoC packaging architecture. The ideal candidate will take part in the development & implementation of new packaging technologies on APTIV SOC products to their qualification & validation from NPI to HVM. Take active part in SOC packaging related and in overall SOC development discussions on NPI, bring-up, improvement of Quality & reliability and Yield to meet performance of Aptiv products.

In this highly visible role, you will lead and drive SoC packaging development & qualification and set up future technologies roadmap to create differentiation for Aptiv SOC chip development and influence suppliers, foundry and OSATs partners roadmap. In your daily job you will:

• Work with internal design, architecture, suppliers and partners to improve packaging of SOC and support supplier selection process by providing technical analysis on packaging designs.
• Interface with cross functional team as well as suppliers to bring up all SoC packaging related aspects and techniques.
• Lead SOC design suppliers in co-designing packaging to optimize SOC floorplan, bump & assembly processes to manufactured product.
• Engage with SOC design suppliers daily/weekly cadence to address and solve SOC chip packaging related issues and provide solutions on problems related to packaging from NPI till mfg. cycle.
• Drive ecosystem partners for SoC package roadmap. Perform package design for ADAS/Cockpit/IVI/CVC applications custom SOC with single-chip/multi-chip and SiP/module packaging, design.
• Take part and lead package related topics with suppliers and internal teams on NPI from concept to mfg. mode.
• Experience with BEOL technologies, TSV designs, FMEA, DOE, material selections defining reliability and qualification test.

Your Background

Key ingredients for succeeding in this role are your:

• BS in Materials Science, Electrical, Mechanical or chemical Engineering with 6+ years of related professional experience.
• Minimum 4 years’ experience in Semiconductor packaging (fab/fabless) environment.
• Packaging experience in semiconductor industry (IDM, Foundry, Fabless), Semiconductor startup, HVM, LVM, NPI qualification and validation of CPU/SOC/ASICs.
• Knowledge of Semiconductor package designs.

Preferred Qualifications

• MS/PHD in Materials Science, Electrical, Mechanical or chemical Engineering with 8-10 years of related professional experience.
• 6+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing.
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules from NPI to Mfg. phases of SOC development.
• Development of advanced packaging technologies (SMT, solder ball attach, and other assembly process) roadmap for Automotive/ SOC products applications.
• Strong communication, presentation, and documentation skills, and working knowledge of circuit design tools.
• Knowledge and experience of Automotive Products (ADAS/Cockpit/CVC/IVI) Quality and packaging concepts.
• Experience in using 2-D and 3-D EM simulation tools.

Why join us?

• You can grow at Aptiv. Aptiv provides an inclusive work environment where all individuals can grow and develop, regardless of gender, ethnicity or beliefs.
• You can have an impact. Safety is a core Aptiv value; we want a safer world for us and our children, one with: Zero fatalities, Zero injuries, Zero accidents.
• You have support. We ensure you have the resources and support you need to take care of your family and your physical and mental health with a competitive health insurance package.

Your Benefits at Aptiv:

• Private health care effective day 1 of employment
• Life and accident insurance
• Paid Time Off (Holidays, Vacation, Designated time off, Parental leave)
• Relocation assistance may be available
• Learning and development opportunities
• Discount programs with various manufacturers and retailers
• Recognition for innovation and excellence
• Opportunities to give back to the community
• Tuition Reimbursement
• Adoption Assistance
• Fertility Coverage

Apply today, and together let’s change tomorrow!

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Aptiv is an equal employment opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, sex, gender identity, sexual orientation, disability status, protected veteran status or any other characteristic protected by law.